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Tantalum Surface Mount Capacitors – Standard Tantalum
T491 Industrial Grade MnO 2 Series
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
T
T 2
?Do
P 2
Po
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
E 1
Ao
F
B 1
Ko
Bo
E 2
W
S 1
P 1
T 1
?D 1
User Direction of Unreeling
Center Lines of Cavity
Cover Tape
B 1 is for tape feeder reference only,
including draft concentric about B o .
Embossment
For cavity size,
see Note 1 Table 4
Table 4 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
8 mm
12 mm
16 mm
D 0
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
D 1 Minimum
Note 1
1.0
(0.039)
1.5
(0.059)
E 1
1.75 ±0.10
(0.069 ±0.004)
P 0
4.0 ±0.10
(0.157 ±0.004)
P 2
2.0 ±0.05
(0.079 ±0.002)
R Reference
Note 2
25.0
(0.984)
30
(1.181)
S 1 Minimum
Note 3
0.600
(0.024)
T Maximum T 1 Maximum
0.600 0.100
(0.024) (0.004)
Tape Size
8 mm
12 mm
16 mm
Pitch
Single (4 mm)
Single (4 mm) &
Double (8 mm)
Triple (12 mm)
B 1 Maximum
Note 4
4.35
(0.171)
8.2
(0.323)
12.1
(0.476)
Variable Dimensions — Millimeters (Inches)
E 2 Minimum F P 1 T 2 Maximum
6.25 3.5 ±0.05 4.0 ±0.10 2.5
(0.246) (0.138 ±0.002) (0.157 ±0.004) (0.098)
10.25 5.5 ±0.05 8.0 ±0.10 4.6
(0.404) (0.217 ±0.002) (0.315 ±0.004) (0.181)
14.25 5.5 ±0.05 8.0 ±0.10 4.6
(0.561) (0.217 ±0.002) (0.315 ±0.004) (0.181)
W Maximum
8.3
(0.327)
12.3
(0.484)
16.3
(0.642)
A 0 , B 0 & K 0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape, with or without components, shall pass around R without damage (see Figure 5).
3. If S 1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481–D, paragraph 4.3, section b).
4. B 1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defi ned by A 0 , B 0 and K 0 shall surround the component with suffi cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 2).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 3).
(e) see Addendum in EIA Standard 481–D for standards relating to more precise taping requirements.
? KEMET Electronics Corporation ? P.O. Box 5928 ? Greenville, SC 29606 (864) 963-6300 ? www.kemet.com
T2005_T491 ? 10/8/2013
18
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